Microwave materials for wireless applications pdf

Bednarz, Rashmi, L. Gence, B. Hackens, H. The high-energy mm - wave weapons are meant to engage Author : Androula G. Firstly, there is not much structure in Recently, several NFMM techniques have been developed for the microwave and millimeter - wave ranges [8—21]. Author : Carlos R. This technique uses the Ptnanowire to bridge the gap between Author : United States.

An example of fielded nanotechnology is the development of microwave and millimeterwave transistors where the Bifurcation-analysis technique for non-linear, parametric effects in 3D magnetic nanodevices at microwaves and photonics The benefits are further enhanced by the use of MCM-D passive components to produce structures such as filters which would normally consume significant space and cost in a conventional design [18]. MCM-D processes have been offering 4 to 10 fold reductions in the area of RF functions when compared to the surface mounted equivalent [20].

MCM-D technology as a solution for use in RF systems offers many significant advantages over more traditional technologies. In particular the size reductions and performance improvements possible allow product developers to meet more closely the requirements of the marketplace. The technology then eases many of the Figure 2. Layout and Q of Passives design problems in bringing RF systems into production [18]. Therefore, results for extremely compact 0. For 0. Also, the thick Aluminum metallization in the packaging process made it possible to get a very high-Q.

This has Figure 1. MCM-D Technology decreased the shunt parasitic capacitance and reduced the eddy current flowing in the ground 5 Designs of Passive Components plane, producing negative mutual inductance effect.

As a result, higher Q and Leff have been achieved Integration of passive elements in a package is the [22]. Without this technology, chip and package only 0. With the ability to Low noise amplifier have made use of both layers integrate resistors, inductors, capacitors and because high inductances as well as better Q were distributed transmission-line elements, chip and required at the same time.

The inductors have been package designs couple closely. This with a maximum quality factor Q up to 64 at 5. The frequency of maximum Q and the costs [5]. Inductors with lower values have higher Q values, The conversion gain is with in the acceptable range, because they can be smaller lower parasitic or use it can be further improved by making the filters with wider metal tracks.

An inductor with a larger more improved performance i. Therefore, inductors with lower inductance values can have higher Q-factors, given a certain technology and application i. The prototype module is intended to demonstrate the concept of SoP. A lot of optimization work on the different blocks, especially on the LNA, is still possible. Figure 3. Receiver front-end layout An on-package integrated multilayer filter offers a more attractive implementation than on-chip and 7 Conclusions discrete filters [21].

There is possibility to improve the filter design by making multilayer inductors by In this document, we have shown the advantages of having the freedom of equal thickness of metal SoP over single-chip solutions. Single-chip solutions layers. The size of the inductors influences much on do not provide complete system integration. A SoP the quality factor.

The quality factor improves by approach using an MCM-D technology is a more increasing the conductor coil width, inner diameter. Moreover, we increasing the number of turns but at the same time have demonstrated that high-quality passive if the inductor is drawn on one layer, this causes the components can be embedded on an MCM-D decrease in quality factor which in turn increases the substrate. These passives can be used together with insertion loss of the filters. This problem can be mounted active components as well as for the design solved by designing multilayer inductors explained.

We have built prototype SoP-integrated necessarily an optimum, but is often a requirement RF modules of a receiver front-end with commercial when using of-the-shelf components or when bare-die components to demonstrate this concept.

This receiver has a measured gain of 18 dB, making It consists of a single class A stage. A single-package approach is neither substrate with the flip-chip technique, explained. All limited to one certain technology, nor to the the passives are integrated in the MCM. Amplifier is Also the antenna is a candidate for future integration designed to be unconditionally stable, which means in the MCM-D module. The amplifier consumes 10 mA for a 2 V power supply [23].

The device has a minimum specified gain of 12 dB. The complete receiver front-end layout design is shown in Figure 3 and has a measured conversion gain of 18 dB shown in Figure 4. The results are comparable with [21], in which copper metal is used whereas, in our design aluminum metal is used which is a cheaper solution.

Figure 4. Takashi, S. Fujita, T. Toshida, H. Density Packaging, Proceedings 7th [4] J. Lasker, A. Sutono, C. Lee, M. Davis, A. International Conference on Apr Obatoyinbo, K. Lim and M. Tentzeris, Page s : Hall, Garret W. Hall, James A.

IC Symp. Wiley-Interscience Publication. Carchon, K. Vaesen, S. Brebels, W. De [18] D. Wein, P. Anderson, J. Babiarz, J. Carter, N. Raedt, E. Beyne, B.

Ono, Y. Fuchida, J. Onomura, M. Amano, [6] R. Tummala, V. Sugiura, K. Yoshihara, E. Takagi, M. Konno, system on package? Conference, Asia and south Pacific, [20] M. McNulty, J. Schnell, D. Nixon, pp Proceedings 51st, [21] Diels, W. Telesystems Conference, National, May Arnold, C.